QFN/QFP Lead Frame Package

QFN (Quad Flat No-lead package) and QFP (Quad Flat package)：

Base on copper Lead Frame QFN and QFP packages with large exposed pads in the center of the package for thermal conduction and conductive pads around the large pads on the periphery of the package for electrical connection. Compared to traditional TSOP/SOT packages, QFN and QFP packages can provide electrical and thermal performance; at the same time, QFP packages can be sufficiently welded around the pins and PCB pads. Combination of good electrical properties and welding reliability.

IOT Series (Bluetooth /wifi, etc.), PMIC (Power Management), Touch IC (Touch Chip), MCU, Mobile Terminal, Smart Home, Industrial Control and Automotive Electronics Applications.

1. Products include WBQFN, FCQFN, and QFP；

2. Wire diameter from 0.7~2.0 mil Copper or gold wire；

3. QFN product size 1.1×0.7~12.3x12.3mm；

4. QFP product size 7×7-48L/10×10-64L /14×14-100L/20×20-144L；

5. Advanced DRQFN (Fine-pitch Dual row QFN), QFN (Wet-table flank QFN)；